About Medshape
We are what the future feels like. As a constantly evolving orthopedic device company that utilizes proprietary advanced material technologies, we fuse brilliant design with surgical expertise. Now surgeons can use the most innovative orthopedic devices anywhere—unique devices created from our shape memory biomaterials that can transform and adapt inside the body. Together, we are dramatically improving the technology of soft tissue fixation, fracture repair, and joint fusions. That kind of change isn’t just good—it’s great!
Dynanail® TTC Fusion System
The DynaNail® TTC Fusion System is designed for tibiotalocalcaneal (TTC) arthrodesis procedures to address degenerative conditions, correct joint deformities and revise failed total ankle replacements or arthrodesis non-unions.
The intramedullary nail system incorporates an innovative super-elastic internal nickel titanium (NiTiNOL) element that automatically adapts in response to bone resorption or joint settling.
Once the nail is fixed in place with screws, the NiTiNOL element maintains the target fusion bones in close apposition and under sustained compression for up to 6 mm of resorption or settling, unlike static, non-adaptive intramedullary devices that lose compression immediately upon frame removal or initial resorption. This natural compression adjustment provides the DynaNail TTC Fusion System with the fusion power of an external fixator while still having the ease and safety of an intramedullary nail.
Surgeons implant the DynaNail TTC Fusion System using a surgical technique similar to that of traditional intramedullary nails, thereby dramatically reducing the learning curve required for the new technology.
Featuring:
- Titanium outer body
- Simple mechanical activation of the super-elastic internal NiTiNOL element
- Rigid, radiolucent, dual-arm targeting frame
- Large range of titanium locking screw sizes
The DynaNail® TTC Fusion System has been cleared by the United States Food and Drug Administration for sales in the United States. Protected by U.S. Patent No. 7,985,222. Other U.S. and International Patents Pending.
